SYLGARD™ 567 Primerless Silicone Encapsulant is a two-part, black, heat-cure silicone encapsulant with good flame resistance and excellent dielectric properties. It features a 1:1 mix ratio, low viscosity for better flow and fill, and requires no additional priming.
SYLGARD™ 567 is suitable for general potting and encapsulation in various applications, including:
| Property | Unit | Part A | Part B |
|---|---|---|---|
| Color | – | Black | Black |
| Viscosity | cP (Pa·s) | 1700 (1.7) | 1600 (1.6) |
| Specific Gravity | – | 1.24 | 1.24 |
| Property | Unit | Result |
|---|---|---|
| Mix Ratio | – | 1:1 |
| Cure Time at 70°C | Minutes | 180 |
| Cure Time at 100°C | Minutes | 120 |
| Durometer Hardness | Shore A | 40 |
| Thermal Conductivity | W/m·K | 0.29 |
| Dielectric Strength | kV/mm (Volts/mil) | 16 (405) |
| Volume Resistivity | Ohm·cm | 6 × 10¹⁶ |
| Dielectric Constant (100 Hz) | – | 2.85 |
| Dielectric Constant (100 kHz) | – | 2.79 |
| Dissipation Factor (100 Hz) | – | 0.008 |
| Dissipation Factor (100 kHz) | – | 0.002 |
| Linear Coefficient of Thermal Expansion (CTE) | ppm | 300 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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