SYLGARD™ 567 Primerless Silicone Encapsulant is a two-part, black, heat-cure silicone encapsulant with good flame resistance and excellent dielectric properties. It features a 1:1 mix ratio, low viscosity for better flow and fill, and requires no additional priming.
SYLGARD™ 567 is suitable for general potting and encapsulation in various applications, including:
| Property | Unit | Part A | Part B |
|---|---|---|---|
| Color | – | Black | Black |
| Viscosity | cP (Pa·s) | 1700 (1.7) | 1600 (1.6) |
| Specific Gravity | – | 1.24 | 1.24 |
| Property | Unit | Result |
|---|---|---|
| Mix Ratio | – | 1:1 |
| Cure Time at 70°C | Minutes | 180 |
| Cure Time at 100°C | Minutes | 120 |
| Durometer Hardness | Shore A | 40 |
| Thermal Conductivity | W/m·K | 0.29 |
| Dielectric Strength | kV/mm (Volts/mil) | 16 (405) |
| Volume Resistivity | Ohm·cm | 6 × 10¹⁶ |
| Dielectric Constant (100 Hz) | – | 2.85 |
| Dielectric Constant (100 kHz) | – | 2.79 |
| Dissipation Factor (100 Hz) | – | 0.008 |
| Dissipation Factor (100 kHz) | – | 0.002 |
| Linear Coefficient of Thermal Expansion (CTE) | ppm | 300 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
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Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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