-Item Name: SYLGARD™ 567 Primerless Silicone Encapsulant
-Manufacturer: The Dow Chemical Company
-Technologies: Two-part, heat cure, 1:1 mix, primerless silicone encapsulant kit
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Techniq VN for details.
-Shelf Life: Contact to Techniq VN for details.
SYLGARD™ 567 Primerless Silicone Encapsulant is a two-part, heat-cure, black silicone encapsulant with a 1:1 mix ratio. It is self-priming, flowable, and provides good flame resistance (UL 94 V-0). The material has low viscosity, enabling it to fill narrow spaces and complex geometries, and offers good dielectric properties. It cures at controlled temperatures and does not require an additional priming step.
SYLGARD™ 567 is suitable for general potting applications, including:
| Property | Unit | Part A | Part B |
|---|---|---|---|
| Color | Black | Black | |
| Viscosity | cP (Pa-sec) | 1700 (1.7) | 1600 (1.6) |
| Specific Gravity | 1.24 | – |
| Property | Unit | Result |
|---|---|---|
| Mix Ratio | 1:1 | |
| Thermal Conductivity | W/m·K (BTU/hr·ft·°F) | 0.29 (0.17) |
| Durometer | Shore A | 40 |
| Dielectric Strength | volts/mil (kV/mm) | 405 (16) |
| Volume Resistivity | ohm·cm | 6 × 10¹⁶ |
| Dielectric Constant (100 Hz) | 2.85 | |
| Dielectric Constant (100 kHz) | 2.79 | |
| Dissipation Factor (100 Hz) | 0.008 | |
| Dissipation Factor (100 kHz) | 0.002 | |
| Linear Coefficient of Thermal Expansion (CTE) | µm/m·°C (ppm) | 300 |
| Heat Cure Time at 70°C | Minutes | 180 |
| Heat Cure Time at 100°C | Minutes | 120 |
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