TECHNOMELT PA 6208 N is a polyamide-based, one-component hotmelt adhesive with thermoplastic properties. It is designed for general assembly applications, providing good adhesion to various substrates, including fabrics, leather, metals, wood, ABS, and flexible vinyl.
| Property | Test Method | Value |
|---|---|---|
| Density (g/cm³, 20°C) | ISO 1183-1 | 0.98 |
| Softening Point (°C) | ASTM E28 (in glycerine) | 150 – 160 |
| Melting Viscosity (mPas) | ASTM D 3236 (RVT, spindle 27) | |
| at 190°C | 6,500 | |
| at 200°C | 4,800 | |
| at 210°C | 2,800 – 4,000 | |
| at 220°C | 2,700 | |
| Temperature Creep Resistance (°C) | Henkel method MH 11 | 130 |
| Yield Strength (N/mm²) | ISO 527 | 3.3 |
| Break Strength (N/mm²) | ISO 527 | 3.6 |
| Elongation (%) | ISO 527 | 600 |
| Shore A Hardness | ISO 868/15s | 82 |
| Low-Temperature Flexibility (°C) | ASTM D 3111 | -40 |
| Working Temperature Range (°C) | -40 to 100 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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