Applications

TECHNOMELT PA 6208 N BLACK (e)

  • Item Name: TECHNOMELT PA 6208 N BLACK (e)
  • Manufacturer: Henkel Corporation
  • Product Category: Hot Melt Adhesive for Electronics (Molding Compound)
  • Technologies: Polyamide
  • Applications: Encapsulation and molding compound applications; suitable for bonding substrates such as metals and ABS
  • Color: Black
  • Cure Type: Physical setting
  • Package size: Contact to Techniq VN for details.
  • Shelf life: 24 months

1. Product Overview

TECHNOMELT PA 6208 N BLACK is a thermoplastic, polyamide-based hot melt adhesive designed for encapsulation and molding applications. It exhibits excellent adhesion to various substrates, including metals and ABS, and offers high flexibility and low-temperature resistance.

  • Technology: Polyamide
  • Appearance: Black
  • Cure Method: Physical setting
  • Application: Encapsulation, molding compound
  • Operating Temperature Range: -40°C to 100°C (application-dependent)
  • UL Flammability Rating: UL 94 V-0

2. Applications

  • Encapsulation of electronic components
  • Protective molding applications
  • Bonding to substrates such as metals and ABS

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