TECHNOMELT® PA 6344 is a one-component polyamide hot melt adhesive designed for low-pressure molding applications. It offers low viscosity, enabling the encapsulation of fragile components without damage. The product forms a protective barrier against environmental factors, providing heat stability, moisture resistance, and UV stability. It is suitable for exterior applications and meets UL 94 V2 flammability standards.
| Property | Value | Test Method |
|---|---|---|
| Appearance | Black | – |
| Specific Gravity (g/cm³) | 1.00 | ASTM D792 |
| Softening Point (°C) | 142 | ASTM E28 (in glycerin) |
| Molding Temperature (°C) | 190 – 230 | – |
| Operating Temperature Range (°C) | 0 – 100 | – |
| Melt Viscosity (mPa·s) | ASTM D3236 | |
| @ 200°C | 18,000 | |
| @ 210°C | 11,000 | |
| @ 225°C | 7,000 | |
| @ 240°C | 3,800 | |
| Shore Hardness (Durometer A) | 80 | ASTM D2240 |
| Elongation (%) | 700 | ASTM D638 |
| E-modulus (N/mm²) | 27.6 (4000 psi) | ASTM D638 |
| Temperature Creep Resistance (°C) | 120 | Henkel Method MH 11 |
| Glass Transition Temperature (°C) | 0 | DSC Second Run |
| Water Absorption (%), 1 day | 0.5 | – |
| Water Absorption (%), 7 days | 1.4 | – |
| Property | Value | Test Method |
|---|---|---|
| Dielectric Constant / Dissipation Factor | Open-ended coaxial probe | |
| @ 1 MHz | 3.18 / 0.0729 | |
| @ 1 GHz | 2.84 / 0.0214 | |
| @ 1.8 GHz | 2.81 / 0.0188 | |
| @ 5.0 GHz | 2.78 / 0.0138 | |
| @ 10 GHz | 2.77 / 0.0099 | |
| @ 20 GHz | 2.76 / 0.0078 | |
| Dielectric Strength (kV/mm) | 23 | ASTM D149 |
| Volume Resistivity (ohm·cm) | 4.8 x 10¹² | ASTM D257 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.