TECHNOMELT® PA 638 BLACK is a one-component, polyamide-based hotmelt adhesive designed for molding applications. It is thermoplastic and cures by physical setting.
| Property | Value | Test Method |
|---|---|---|
| Density (g/cm³) at 20°C | 0.98 | ISO 1183-1 |
| Softening Point (°C) | 170–180 | ASTM E28 (in glycerine) |
| Melting Viscosity (mPas) | 5,000 at 200°C 2,800–4,000 at 210°C 2,900 at 220°C 2,300 at 230°C |
ASTM D 3236 (RVT, spindle 27) |
| Shore A Hardness | 90 | ISO 868/15s |
| Yield Strength (N/mm²) | 4.5 | ISO 527 (Cross-head speed: 50mm/min) |
| Break Strength (N/mm²) | 5.2 | ISO 527 (Cross-head speed: 50mm/min) |
| Elongation (%) | 300 | ISO 527 |
| Temperature Creep Resistance (°C) | 155 | Henkel method MH 11 |
| Low Temperature Flexibility (°C) | -30 | ASTM D 3111 |
| Glass Transition (°C) | -36 | DSC, 2nd Run |
| Flammability | UL 94 V-0 | – |
| Working Temperature Range (°C) | -40 to 130 | Depends on application |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
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