TECHNOMELT® PA 646 BLACK is a one-component polyamide hot melt adhesive designed for low-pressure molding applications. It offers excellent moldability, good adhesion to various substrates, and strong environmental and moisture resistance. The adhesive is ideal for encapsulating fragile electronic components due to its low viscosity and minimal molding pressure requirements.
| Property | Value | Test Method |
|---|---|---|
| Specific Gravity @ 20°C | 0.98 g/cm³ | ISO 1183 |
| Softening Point | 170 – 180°C | ASTM E28 |
| Melt Viscosity (mPa·s) | @210°C: 6,500 @220°C: 4,500 @225°C: 3,000 – 5,500 @230°C: 3,000 |
ASTM D 3236 |
| Shore Hardness (A, 15s) | 92 | DIN EN ISO 868 |
| Elongation (%) | 650 | ISO 527 |
| Low Temperature Flexibility | -35°C | ASTM D3111 |
| Temperature Creep Resistance | 155°C | Henkel Method MH 11 |
| Tensile Strength at Break | 9.0 N/mm² (1305 psi) | ISO 527 |
| Yield Strength | 5.0 N/mm² (725 psi) | ISO 527 |
| Property | Value | Test Method |
|---|---|---|
| Dielectric Strength | 22 kV/mm | IEC 60243 |
| Volume Resistivity | 1.7 × 10¹² ohm-cm | DIN IEC 60093 |
| Dielectric Constant / Dissipation Factor | 1 GHz: 2.73 / 0.021 5 GHz: 2.66 / 0.020 10 GHz: 2.66 / 0.019 50 GHz: 2.62 / 0.007 |
Open C |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.