TECHNOMELT® PA 646 BLACK is a one-component polyamide hot melt adhesive designed for low-pressure molding applications. It offers excellent moldability, good adhesion to various substrates, and strong environmental and moisture resistance. The adhesive is ideal for encapsulating fragile electronic components due to its low viscosity and minimal molding pressure requirements.
| Property | Value | Test Method |
|---|---|---|
| Specific Gravity @ 20°C | 0.98 g/cm³ | ISO 1183 |
| Softening Point | 170 – 180°C | ASTM E28 |
| Melt Viscosity (mPa·s) | @210°C: 6,500 @220°C: 4,500 @225°C: 3,000 – 5,500 @230°C: 3,000 |
ASTM D 3236 |
| Shore Hardness (A, 15s) | 92 | DIN EN ISO 868 |
| Elongation (%) | 650 | ISO 527 |
| Low Temperature Flexibility | -35°C | ASTM D3111 |
| Temperature Creep Resistance | 155°C | Henkel Method MH 11 |
| Tensile Strength at Break | 9.0 N/mm² (1305 psi) | ISO 527 |
| Yield Strength | 5.0 N/mm² (725 psi) | ISO 527 |
| Property | Value | Test Method |
|---|---|---|
| Dielectric Strength | 22 kV/mm | IEC 60243 |
| Volume Resistivity | 1.7 × 10¹² ohm-cm | DIN IEC 60093 |
| Dielectric Constant / Dissipation Factor | 1 GHz: 2.73 / 0.021 5 GHz: 2.66 / 0.020 10 GHz: 2.66 / 0.019 50 GHz: 2.62 / 0.007 |
Open C |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
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