TECHNOMELT® PA 652 N is a high-performance thermoplastic polyamide hotmelt adhesive designed for low-pressure molding applications. It has low viscosity, allowing encapsulation of fragile components without damage. This product offers excellent adhesion and cold-temperature flexibility.
| Property | Value | Test Method |
|---|---|---|
| Density @ 20°C (g/cm³) | 0.98 | – |
| Softening Point (°C) | 150 – 165 | ASTM E28 |
| Melting Viscosity (mPa·s) at: | ASTM D-3236 | |
| – 180°C | 9,500 | |
| – 190°C | 7,000 | |
| – 200°C | 5,400 | |
| – 210°C | 4,000 |
| Property | Value | Test Method |
|---|---|---|
| Hardness (Shore A) | 77 | ISO 868/15s |
| Elongation (%) | 400 | ISO 527 |
| Yield Strength (N/mm² / psi) | 2.6 / 377 | ISO 527 |
| Breaking Strength (N/mm² / psi) | 2.7 / 392 | ISO 527 |
| Temperature Creep Resistance (°C) | 125 | Henkel Method 11 |
| Low Temperature Flexibility (°C) | -50 | ASTM D3111 |
| Glass Transition Temperature (°C) | -45 | DSC |
| Property | Value |
|---|---|
| Volume Resistivity (Ω·cm) | 1×10¹² |
| Dielectric Strength (kV/mm) | >14 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
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