Applications

TECHNOMELT® PA 652 N – Polyamide hot melt adhesive for low pressure molding and encapsulation applications

  • Item Name: TECHNOMELT® PA 652 N
  • Manufacturer: Henkel
  • Product Category: Hotmelt Adhesive
  • Technologies: Polyamide, Thermoplastic, Low-Pressure Molding
  • Applications: Encapsulation of fragile components, molding with excellent adhesion and cold temperature flexibility
  • Color: Amber
  • Cure Type: Physical setting
  • Package Size: Contact Techniq VN for details
  • Shelf Life: Contact Techniq VN for details

1. Product Overview

TECHNOMELT® PA 652 N is a high-performance thermoplastic polyamide hotmelt designed for low-pressure molding applications. Its low viscosity allows safe encapsulation of fragile components without damage. The product provides excellent adhesion and flexibility in low-temperature environments.

  • Technology: Polyamide
  • Type: Hotmelt, thermoplastic
  • Cure: Physical setting
  • Appearance: Amber
  • Operating Temperature Range: -40 to 100°C (application-dependent)
  • UL Rating: UL 94 V-0

2. Applications

  • Encapsulation of fragile electronic components
  • Low-pressure molding applications
  • Assemblies requiring excellent adhesion and flexibility at cold temperatures

3. Typical Properties

Uncured Properties

Property Value Test Method
Density @ 20°C 0.98 g/cm³
Melting Viscosity (mPa·s) @180°C: 9,500
@190°C: 7,000
@200°C: 5,400
@210°C: 4,000
ASTM D-3236
Softening Point 150-165°C ASTM E28

Cured Properties

Property Value Test Method
Hardness 77 Shore A ISO 868
Elongation 400% ISO 527
Yield Strength 2.6 N/mm² (377 psi) ISO 527
Breaking Strength 2.7 N/mm² (392 psi) ISO 527
Temperature Creep Resistance 125°C Henkel Method 11
Low Temperature Flexibility -50°C ASTM D3111
Glass Transition Temperature (Tg) -45°C DSC Second Run

Electrical Properties

Property Value
Volume Resistivity 1×10¹² ohm-cm
Dielectric Strength >14 kV/mm

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