TECHNOMELT® PA 657 N BLACK is a polyamide hot melt adhesive designed for low-pressure molding applications. It offers:
| Property | Value | Test Method |
|---|---|---|
| Viscosity (mPa·s) | @180°C: 8,600 @190°C: 6,500 @200°C: 4,900 @210°C: 3,000-4,500 | ASTM D3236 |
| Shore Hardness (A) | 77 | DIN EN ISO 868/15s |
| Elongation (%) | 350 | ISO 527 |
| E-Modulus (N/mm²) | 25 (3,625 psi) | ASTM D638 |
| Low Temp. Flexibility (°C) | -50 | ASTM D3111 |
| Temp. Creep Resistance (°C) | 125 | Henkel MH 11 |
| Glass Transition Temp. (Tg, °C) | -45 | DSC Second Run |
| Water Absorption (% at 23°C, 1 day) | 1.4 | – |
| Tensile at Break (N/mm²) | 2.7 (390 psi) | ISO 527 |
| Yield Strength (N/mm²) | 2.6 (375 psi) | ISO 527 |
| Specific Gravity @ 20°C (g/cm³) | 0.98 | ISO 1183-1 |
| Softening Point (°C) | 150-165 | ASTM E28 |
| Dielectric Constant / Dissipation Factor | @1MHz: 4.1/0.105 @1GHz: 2.8/0.038 @1.8GHz: 2.7/0.029 | Open-ended coaxial probe |
| Dielectric Strength (kV/mm) | 15 | IEC 60243 |
| Volume Resistivity (ohm-cm) | 0.6 × 10¹² | DIN IEC 60093 |
| Comparative Tracking Index (V) | 600 | IEC 60112 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
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