TECHNOMELT PA 678 (e) is a high-performance thermoplastic polyamide designed for low-pressure molding applications. It features:
| Property | Value |
|---|---|
| Viscosity @ 210°C | 3,400 mPa∙s (cP) |
| Density | 0.98 g/cm³ |
| Softening Point | 187°C |
| Property | Recommended Range |
|---|---|
| Molding Temperature | 210°C – 240°C |
Physical Properties
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) | -50°C |
| Thermal Conductivity | 0.15 W/m-°C |
| Shore Hardness | 88 (Shore A) |
| Elongation at Break | 400% |
Electrical Properties
| Property | Value |
|---|---|
| Dielectric Strength | >20 kV/mm |
| Volume Resistivity | 1.9 × 10¹² ohms-cm |
| Comparative Tracking Index (IEC 60112) | 600V |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
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