• Item Name: Techspray® No-Clean Desoldering Braid
• Manufacturer: Techspray® / ITW Contamination Control BV
• Technologies: No-clean flux coated copper braid
• Color: White, Yellow, Green, Blue, Brown, Red (depending on braid size)
• Cure Type: Not applicable
• Package Size: 5 ft to 100 ft spools (ESD-safe options available); Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
Techspray® No-Clean Desoldering Braid is a rosin flux-coated braid designed to remove solder efficiently while leaving no ionic residues that can cause dendrite formation. This prevents latent electrical failures and improves long-term reliability of PCBs. Anti-static spools are available to protect sensitive electronic components.
High-volume PCB production and repair
Desoldering with minimal residue
Safe use on sensitive electronic components
| Property | Specification / Value |
|---|---|
| Flux Type | No-clean, rosin-coated |
| Residue | Clear, non-reactive, avoids dendrites |
| Exceeds | MIL-F-14256, NASA NHB 5300, NASA NPC 200-4, NASA SP5002, IPC Standard-J-STD-004 |
| Anti-Static | Yes (on marked spools) |
| Color Coding | #1 White, #2 Yellow, #3 Green, #4 Blue, #5 Brown, #6 Red |
| Width Range | 0.035 in (0.9 mm) to 0.193 in (4.9 mm) |
| Length Options | 5 ft (1.5 m) – 100 ft (30.5 m) depending on size and part# |
Leaves no ionic residue, preventing dendrite failures
Fast and clean solder wicking action
Meets/exceeds key military and NASA standards
Anti-static options for sensitive components
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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