• Item Name: Silicone Heat Sink Compound
• Manufacturer: Techspray® / ITW Contamination Control BV
• Technologies: Thermally conductive, non-hardening silicone paste
• Color: White
• Cure Type: Not applicable
• Package Size: 4 oz. tube
• Shelf Life: 5 years
Silicone Heat Sink Compound is a thermally conductive paste designed to efficiently draw heat away from electronic components, including thermocouple wells, thermistors, and calrods. It remains stable across a wide temperature range, will not harden or crack, and is easy to apply. The compound is non-ozone-depleting and ensures reliable heat transfer for effective cooling in electronic and industrial applications.
Heat dissipation for thermocouple wells, thermistors, and calrods
Cooling of electronic components and assemblies
General thermal interface applications requiring stable heat transfer
Before Use / Ready-to-Use
| Property | Value |
|---|---|
| Physical State | Semisolid |
| Appearance | White paste |
| Thermal Conductivity | 0.70 W/m-K |
| Functional Temperature Range | 67°F to 401°F (-55°C to 205°C) |
| Vapor Pressure | <0.1 mmHg |
| Freezing Point | -40°F (-40°C) |
| Flash Point | >400°F (204°C) |
| Solubility in Water | Insoluble |
| Evaporation Rate | <0.01 (n-Butyl Acetate = 1) |
| Specific Gravity | 2.4 (water = 1) |
| Shelf Life | 5 years |
After Application / Operational Properties
| Property | Value |
|---|---|
| Thermal Performance | Maintains efficient heat transfer under operating temperature range |
| Physical Stability | Will not harden or crack over time |
| Application Ease | Spreadable and easy to apply for optimal component contact |
| Environmental Safety | Non-ozone-depleting |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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