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tesa® 4985 – Transparent tacky transfer tape for posters, photos, fabric mounting, paper splicing

Item Name: tesa® 4985
Manufacturer: tesa SE
Technologies: Transparent tacky transfer tape with modified acrylic adhesive
Color: Transparent (liner brown)
Backing material: None
Type of adhesive: Tackified acrylic
Package Size: Contact to Techniq VN for details
Shelf Life: Contact to Techniq VN for details

1. Product Overview

tesa® 4985 is a transparent tacky transfer tape using a modified acrylic adhesive. It provides excellent conformability, good immediate grab on uneven surfaces, and smooth dispensing performance when used with compatible dispensers. The tape offers durable adhesion, UV and humidity resistance, and is suitable for a variety of light-duty mounting and splicing applications.


2. Applications

  • Mounting posters and photos.

  • Mounting fabrics for pattern books.

  • Splicing of paper.

3. Typical Properties

Property Value
Backing material None
Adhesive type Tackified acrylic
Liner type Glassine
Liner colour Brown
Liner thickness 71 µm
Liner weight 80 g/m²
Ageing resistance (UV) Very good
Chemical resistance Good
Humidity resistance Very good
Softener resistance Good
Static shear resistance 23 °C Medium
Static shear resistance 40 °C Low
Tack Very good
Temperature resistance (long-term) 80 °C
Temperature resistance (short-term) 200 °C
Adhesion ABS (initial / 14 days) 6.9 / 9.3 N/cm
Adhesion Aluminium (initial / 14 days) 7.1 / 10 N/cm
Adhesion PC (initial / 14 days) 7.6 / 9.7 N/cm
Adhesion PE (initial / 14 days) 4.1 / 4.9 N/cm
Adhesion PET (initial / 14 days) 4.9 / 6.4 N/cm
Adhesion PP (initial / 14 days) 3.5 / 5.7 N/cm
Adhesion PS (initial / 14 days) 7.2 / 9.5 N/cm
Adhesion PVC (initial / 14 days) 6.8 / 9.4 N/cm
Adhesion Steel (initial / 14 days) 8 / 11.1 N/cm

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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