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tesa® 60381 – Conductive woven acrylic tape – EMC, FPC grounding, antenna grounding, electrostatic discharge applications

  • Item Name: tesa® 60381

  • Manufacturer: tesa SE

  • Technologies: Electrically conductive double-sided self-adhesive tape

  • Color: Grey

  • Backing material: Conductive woven

  • Type of adhesive: Conductive acrylic

  • Package Size: Contact to Techniq VN for details

  • Shelf Life: Contact to Techniq VN for details

1. Product overview
tesa® 60381 is a 50µm double-sided grey electrically conductive adhesive tape. It features a conductive woven backing combined with a conductive acrylic adhesive, providing high peel adhesion, reliable conductivity across XYZ-directions, and strong anti-repulsion properties. With good tear resistance and performance stability in heat and humidity, it is well-suited for demanding electronic bonding applications.

2. Applications
This tape is suitable for EMC applications, FPC grounding, antenna grounding, and electrostatic discharge (ESD) control. Its balance of electrical conductivity and strong adhesion ensures reliability in both mechanical and electrical functions in sensitive electronic systems.

3. Typical Properties

Property Value / Description
Backing material Electrically conductive woven
Adhesive type Conductive acrylic
Liner PET, transparent, 23 µm (with 50 µm tight liner outside roll)
Total thickness 50 µm
Colour Grey
Contact resistance (Z-direction) 0.06 Ω/sq. inch
Surface resistance (X-Y) 0.3 Ω/sq.
Adhesion to steel 8 N/cm (initial), 10 N/cm (14 days)
Static shear resistance (40°C) Very good
Temperature resistance (short-term) Up to 180°C
Key features High peel adhesion, anti-repulsion, tear resistant

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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