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Thermal Management

tesa® 60384 – Conductive woven acrylic tape – EMC, FPC grounding, antenna grounding, electrostatic discharge applications

  • Item Name: tesa® 60384

  • Manufacturer: tesa SE

  • Technologies: Electrically conductive double-sided self-adhesive tape

  • Color: Grey

  • Backing material: Conductive woven

  • Type of adhesive: Conductive acrylic

  • Package Size: Contact to Techniq VN for details

  • Shelf Life: Contact to Techniq VN for details

1. Product overview
tesa® 60384 is a 100µm double-sided grey electrically conductive adhesive tape built with a conductive woven backing and conductive acrylic adhesive. It offers strong bonding with very high peel adhesion, excellent anti-repulsion properties, and reliable conductivity across XYZ-directions under heat and humidity. The tape is engineered for durability, providing good tear resistance and stable performance in electronic applications.

2. Applications
This tape is designed for EMC solutions, FPC grounding, antenna grounding, and electrostatic discharge (ESD) applications. Its high bonding strength and conductivity make it suitable for demanding electronic assemblies requiring both mechanical and electrical reliability.

3. Typical Properties

Property Value / Description
Backing material Electrically conductive woven
Adhesive type Conductive acrylic
Liner PET, transparent, 23 µm (with 50 µm tight liner outside roll)
Total thickness 100 µm
Colour Grey
Contact resistance (Z-direction) 0.06 Ω/sq. inch
Surface resistance (X-Y) 0.3 Ω/sq.
Adhesion to steel 8 N/cm (initial), 10 N/cm (14 days)
Static shear resistance (40°C) Very good
Temperature resistance (short-term) Up to 180°C
Key features High peel adhesion, anti-repulsion, tear resistant

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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