• Item Name: tesa® 62904
• Manufacturer: tesa SE
• Technologies: Conformable PE foam, tackified acrylic adhesive, high adhesion, cold shock resistant
• Color: Black
• Backing material: PE foam
• Type of adhesive: Acrylic
• Package Size: Contact to Techniq VN for details
• Shelf Life: Contact to Techniq VN for details
tesa® 62904 PV0 is a 0.4 mm double-sided PE foam tape with a black backing and tackified acrylic adhesive. Designed for small trims, emblems, and nameplates, it provides a nearly invisible bond line. The conformable foam ensures good wet-out and bonding on uneven surfaces while compensating design tolerances. Its adhesive offers high initial and long-term adhesion on MSE plastics such as ABS, PC, PMMA, and coated surfaces. The tape also demonstrates excellent cold shock performance, lightweight construction, and superior converting properties for precision die-cutting.
Mounting of emblems and nameplates
Bonding single-letter car model or engine data markings
Fixing interior and exterior mirrors onto backplates
Small exterior trims and decorative automotive parts, including filigree designs
| Property | Value |
|---|---|
| Backing material | PE foam |
| Adhesive type | Tackified acrylic |
| Liner | Glassine |
| Total thickness | 400 µm (also available in 0.6 mm) |
| Colour | Black |
| Elongation at break | 350 % |
| Tensile strength | 9 N/cm |
| Static shear resistance | Good at 40 °C & 70 °C |
| Temperature resistance | Long-term 90 °C; Short-term 100 °C |
| Adhesion ABS | Initial: 6 N/cm; 14 days: 21 N/cm |
| Adhesion PC | 21 N/cm after 14 days |
| Adhesion steel | Initial: 15 N/cm; 14 days: 21 N/cm |
| Cold shock resistance | Excellent, effective below -40 °C |
| Converting properties | Non-sticky edges, excellent for die-cutting |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.