• Item Name: tesa HAF® 8474
• Manufacturer: tesa SE
• Technologies: Heat activated adhesive film (phenolic resin/nitrile rubber)
• Color: Amber
• Backing material: None
• Type of adhesive: Nitrile rubber / phenolic resin
• Package Size: Contact to Techniq VN for details
• Shelf Life: Contact to Techniq VN for details
tesa® HAF 8474 is a heat-activated, double-sided thermosetting film made from phenolic resin and nitrile rubber, with no backing and protected by a strong paper liner. It is halogen-free and RoHS-compliant. Inactive at room temperature, it requires heat and pressure for activation, enabling strong, elastic, and aging-resistant bonds. The tape is highly conformable, produces minimal oozing, and ensures reliable bonding between plastic and metal surfaces, even in small or high-stress areas.
Bonding metal components (e.g., SUS or AL) to plastics such as PMMA, PC, or ABS.
Assembly of mobile phone window frames and front covers.
Constructive bonding inside handheld devices.
Multi-media card applications.
Long-term applications exposed to mechanical stress.
| Property | Value |
|---|---|
| Backing material | None |
| Adhesive type | Nitrile rubber / phenolic resin |
| Liner type | Glassine |
| Total thickness | 100 µm |
| Colour | Amber |
| Bonding strength (push-out) | 11 N/mm² |
| Pre-lamination temperature | 90–120 °C |
| Pre-lamination pressure | 2–6 bar |
| Pre-lamination time | 1.5–3 s |
| Bonding temperature | 180–220 °C |
| Bonding pressure | 2–10 bar |
| Bonding time | 3–10 s |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.