Applications

THERMELT® 817R Natural – Hot melt resin for low pressure molding of electronic components

  • Item Name: THERMELT® 817R Natural

  • Manufacturer: Bostik S.A.

  • Technologies: Polyamide hot melt resin, non-reactive

  • Color: Natural

  • Cure Type: Contact to Techniq VN for details.

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 18 months

1. Product Overview

Thermelt® 817R Natural is a pure copolyamide, non-reactive hot melt resin designed for low-pressure molding applications. It features:

  • Good wetting at application temperature

  • Short open time and fast setting time

  • Low viscosity at application temperature

  • UL 94 V0 flammability rating


2. Applications

Primarily used for:

  • Molding of electronic and electrical components

  • Connectors

  • Cables

3. Typical Properties

a) Physical Properties (Unmixed / As Supplied)

Property Value Test Standard
Viscosity (205°C, SC4-S27, 50 RPM) [Pa.s] 0.5 ASTM D3236
Softening Point (Cup & Ball) [°C] 165 ASTM D3461
Water Content [%] <0.2 Bostik
Hardness (23°C, 15s) [Shore D] 28 ISO 868
Density ~1 Internal test
Water Absorption (7 days, 23°C) [%] 0.9 ISO 62
Glass Transition (DSC) [°C] -10 Bostik
Flammability V0 UL 94
Colour Natural
Commercial Shape Pellets

b) Mechanical Properties

Property Value Test Standard
Max Stress (50 mm/min, 23°C) [MPa] >4 ISO 527
Elongation at Break (50 mm/min, 23°C) [%] >50 ISO 527
Young’s Modulus (50 mm/min, 23°C) [MPa] 120 ISO 527

c) Processing Conditions

Parameter Recommended Value
Melt Temperature Range [°C] 180 – 210
Mold Temperature Range [°C] 20 – 60
Drying Time (Air oven, thin layer) [h] 6
Drying Temperature [°C] 80

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