Applications

THERMELT® 866 Natural – Hot melt resin for low pressure molding of electronic components

  • Item Name: THERMELT® 866 Natural

  • Manufacturer: Bostik S.A.

  • Technologies: Polyamide hot melt resin, non-reactive, solvent-free

  • Color: Natural

  • Cure Type: Low pressure molding

  • Package Size: 20 kg bag

  • Shelf Life: 12 months

1. Product Overview

Thermelt® 866 Natural is a pure copolymer polyamide hot melt resin, non-reactive and solvent-free, designed for low-pressure molding applications.
Key features include:

  • Enhanced adhesion

  • Standard molding resin properties

  • Good wettability at application temperature

  • Short open and setting time


2. Applications

Primarily used for:

  • Molding of electronic and electrical components

  • Connectors

  • Cables

3. Typical Properties

a) Physical Properties (Unmixed / As Supplied)

Property Value Test Standard
Viscosity (190°C, SC4, 50 RPM) [Pa.s] 2.3–3.6 ASTM D3236
Softening Point [°C] 150–162 ASTM D3461
Water Content [%] <0.2 Bostik
Hardness (23°C) [Shore D] 30 ISO 868
Density ~1 Internal test
Water Absorption (Immersed, 23°C) [%] 2.2 ISO 62
Glass Transition (DSC) [°C] -30 Bostik
Commercial Shape Pellets
Packaging 20 kg bag

b) Mechanical Properties

Property Value Test Standard
Yield Strength (50 mm/min, 23°C) [MPa] 2.3 ISO 527
Strength at Break (50 mm/min, 23°C) [MPa] 2.1 ISO 527
Elongation at Break (50 mm/min, 23°C) [%] 530 ISO 527
Young’s Modulus (50 mm/min, 23°C) [MPa] 21 ISO 527

c) Thermal Properties

Property Value Test Standard
Vicat Temperature (A 120, 10N, 120°C/h) [°C] / ISO 306
Glass Transition (DSC) [°C] -30 Bostik

d) Processing Conditions

Parameter Recommended Value
Melt Temperature Range [°C] 180–210
Mold Temperature Range [°C] 20–60
Drying Time (Air oven, thin layer) [h] 8
Drying Temperature [°C] 70
Processing Moisture Content [%] <0.2

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