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THERMELT® 866 Natural – Hot melt resin for low pressure molding of electronic components

  • Item Name: THERMELT® 866 Natural

  • Manufacturer: Bostik S.A.

  • Technologies: Polyamide hot melt resin, non-reactive, solvent-free

  • Color: Natural

  • Cure Type: Low pressure molding

  • Package Size: 20 kg bag

  • Shelf Life: 12 months

1. Product Overview

Thermelt® 866 Natural is a pure copolymer polyamide hot melt resin, non-reactive and solvent-free, designed for low-pressure molding applications.
Key features include:

  • Enhanced adhesion

  • Standard molding resin properties

  • Good wettability at application temperature

  • Short open and setting time


2. Applications

Primarily used for:

  • Molding of electronic and electrical components

  • Connectors

  • Cables

3. Typical Properties

a) Physical Properties (Unmixed / As Supplied)

Property Value Test Standard
Viscosity (190°C, SC4, 50 RPM) [Pa.s] 2.3–3.6 ASTM D3236
Softening Point [°C] 150–162 ASTM D3461
Water Content [%] <0.2 Bostik
Hardness (23°C) [Shore D] 30 ISO 868
Density ~1 Internal test
Water Absorption (Immersed, 23°C) [%] 2.2 ISO 62
Glass Transition (DSC) [°C] -30 Bostik
Commercial Shape Pellets
Packaging 20 kg bag

b) Mechanical Properties

Property Value Test Standard
Yield Strength (50 mm/min, 23°C) [MPa] 2.3 ISO 527
Strength at Break (50 mm/min, 23°C) [MPa] 2.1 ISO 527
Elongation at Break (50 mm/min, 23°C) [%] 530 ISO 527
Young’s Modulus (50 mm/min, 23°C) [MPa] 21 ISO 527

c) Thermal Properties

Property Value Test Standard
Vicat Temperature (A 120, 10N, 120°C/h) [°C] / ISO 306
Glass Transition (DSC) [°C] -30 Bostik

d) Processing Conditions

Parameter Recommended Value
Melt Temperature Range [°C] 180–210
Mold Temperature Range [°C] 20–60
Drying Time (Air oven, thin layer) [h] 8
Drying Temperature [°C] 70
Processing Moisture Content [%] <0.2

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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