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Thermal Management

THERMELT® 867HV Black – Hot melt resin for low pressure molding of electronic components

  • Item Name: THERMELT® 867HV Black

  • Manufacturer: Bostik S.A.

  • Technologies: Polyamide hot melt resin, non-reactive

  • Color: Black

  • Cure Type: Contact to Techniq VN for details.

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 18 months

1. Product Overview

Thermelt® 867HV Black is a pure copolyamide, non-reactive hot melt resin designed for low-pressure molding applications. It features:

  • Enhanced mechanical properties for higher flexibility and cohesion

  • Good wettability at application temperature

  • Good temperature resistance

  • UL 94 V0 flammability rating


2. Applications

Primarily used for:

  • Molding of electronic and electrical components

  • Connectors

  • Cables

3. Typical Properties

a) Physical Properties (Unmixed / As Supplied)

Property Value Test Standard
Viscosity (220°C, SC4-S27, 50 RPM) [Pa.s] 11.5 ASTM D3236
Softening Point (Cup & Ball) [°C] 187 ASTM D3461
Water Content [%] <0.2 Bostik
Hardness (23°C, 15s) [Shore D] 30 ISO 868
Density ~1 Internal test
Water Absorption (7 days, 23°C) [%] 2.6 ISO 62
Glass Transition (DSC) [°C] -40 Bostik
Flammability V0 UL 94
Colour Black
Commercial Shape Pellets

b) Mechanical Properties

Property Value Test Standard
Max Stress (50 mm/min, 23°C) [MPa] >6 ISO 527
Elongation at Break (50 mm/min, 23°C) [%] >450 ISO 527
Young’s Modulus (50 mm/min, 23°C) [MPa] 85 ISO 527

c) Electrical Properties

Property Value Test Standard
Transversal Resistivity (500V) [Ω·cm] 1×10¹¹ IEC 62631-3
Dielectric Rigidity (23°C) [kV/mm] 19 IEC 60243-1
Relative Permittivity (1MHz, 23°C) [F/m] 3.8 ASTM D150
Relative Permittivity (1GHz, 23°C) [F/m] 2.8 ASTM D150
Relative Permittivity (5GHz, 23°C) [F/m] 2.6 ASTM D2520

d) Processing Conditions

Parameter Recommended Value
Melt Temperature Range [°C] 210 – 230
Mold Temperature Range [°C] 20 – 60
Drying Time (Air oven, thin layer) [h] 6
Drying Temperature [°C] 80

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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