Applications

THERMELT® 868 Natural – Hot melt resin for low pressure molding of electronic components

  • Item Name: THERMELT® 868 Natural

  • Manufacturer: Bostik S.A.

  • Technologies: Polyamide hot melt resin, non-reactive

  • Color: Natural

  • Cure Type: Contact to Techniq VN for details.

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 18 months

1. Product Overview

Thermelt® 868 Natural is a pure copolyamide, non-reactive hot melt resin designed for low-pressure molding applications. It features:

  • Enhanced UV resistance compared to standard PA

  • Light-colored and soft material

  • Good fluidity at application temperature

  • UL 94 V0 flammability rating


2. Applications

Primarily used for:

  • Molding of electronic and electrical components

  • Connectors

  • Cables

3. Typical Properties

a) Physical Properties (Unmixed / As Supplied)

Property Value Test Standard
Viscosity (200°C, SC4-S27, 50 RPM) [Pa.s] 3.6 ASTM D3236
Softening Point (Cup & Ball) [°C] 162 ASTM D3461
Water Content [%] <0.2 Bostik
Hardness (23°C, 15s) [Shore D] 20 ISO 868
Density ~1 Internal test
Water Absorption (7 days, 23°C) [%] 2.5 ISO 62
Glass Transition (DSC) [°C] -25 Bostik
Flammability V0 UL 94
Colour Natural
Commercial Shape Pellets

b) Mechanical Properties

Property Value Test Standard
Max Stress (50 mm/min, 23°C) [MPa] >2.5 ISO 527
Elongation at Break (50 mm/min, 23°C) [%] >200 ISO 527
Young’s Modulus (50 mm/min, 23°C) [MPa] 55 ISO 527

c) Electrical Properties

Property Value Test Standard
Transversal Resistivity (500V) [Ω·cm] 1×10¹¹ IEC 62631-3
Dielectric Rigidity (23°C) [kV/mm] 19 IEC 60243-1
Relative Permittivity (1MHz, 23°C) [F/m] 3.4 ASTM D150
Relative Permittivity (1GHz, 23°C) [F/m] 2.7 ASTM D150
Relative Permittivity (5GHz, 23°C) [F/m] 2.6 ASTM D2520

d) Processing Conditions

Parameter Recommended Value
Melt Temperature Range [°C] 180 – 210
Mold Temperature Range [°C] 20 – 60
Drying Time (Air oven, thin layer) [h] 6
Drying Temperature [°C] 80

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