Applications

THERMELT® 892 Black – Hot melt resin for low pressure molding of electronic components

  • Item Name: THERMELT® 892 Black

  • Manufacturer: Bostik S.A.

  • Technologies: Polyamide hot melt resin, non-reactive

  • Color: Black

  • Cure Type: Low pressure molding

  • Package Shape: Pellets

  • Shelf Life: 18 months

1. Product Overview

Thermelt® 892 Black is a pure copolyamide hot melt resin, non-reactive, designed for low-pressure molding applications.
Key features:

  • Low moisture uptake

  • High hardness and cohesion

  • Good resistance to harsh environmental conditions (%HR, °C)

  • Compliant with UL 94 V0 flammability


2. Applications

Mainly used for:

  • Molding of electronic/electric components

  • Connectors

  • Cables

3. Typical Properties

a) Physical Properties

Property Value Test Standard
Viscosity (200°C, SC4-S27, 50 RPM) [Pa.s] 4.6 ASTM D3236
Softening Point (Cup & Ball) [°C] 174 ASTM D3461
Water Content [%] <0.2 Bostik
Hardness (23°C, 15s) [Shore D] 35 ISO 868
Density ~1 Internal test
Water Absorption (Immersed 7 days, 23°C) [%] 0.9 ISO 62
Glass Transition (DSC) [°C] -35 Bostik
Commercial Shape Pellets

b) Mechanical Properties

Property Value Test Standard
Max Stress (50 mm/min, 23°C) [MPa] >7 ISO 527
Elongation at Break (50 mm/min, 23°C) [%] >400 ISO 527
Young’s Modulus (50 mm/min, 23°C) [MPa] 180 ISO 527

c) Electrical Properties

Property Value Test Standard
Transversal Resistivity (500V) [Ω.cm] 1.10 × 10¹² IEC 62631-3
Dielectric Rigidity (23°C) [kV/mm] 19 IEC 60243-1
Relative Permittivity (50Hz, 23°C) IEC 62631-2
Relative Permittivity (1kHz, 23°C) 4 IEC 62631-2
Relative Permittivity (1MHz–5GHz, 23°C) – , – , – ASTM D150 / ASTM D2520

d) Processing Conditions

Parameter Recommended Value
Melt Temperature Range [°C] 200–230
Mold Temperature Range [°C] 20–60
Drying Time (Air oven, thin layer) [h] 6
Drying Temperature [°C] 80

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