Applications

TSE3250 – Silicone adhesive for potting, encapsulation, and coating of electronic devices and circuits

  • Item Name: TSE3250

  • Manufacturer: Momentive Performance Materials

  • Technologies: One-component, heat-curable silicone adhesive

  • Color: Transparent

  • Cure Type: Heat cure (100°C–150°C depending on cycle)

  • Package Size: 1 kg cans, 15 kg pails

  • Shelf Life: Minimum 3 months

1. Product Overview

TSE3250 is a one-component, heat-curable silicone adhesive with low viscosity, designed primarily for potting and encapsulation. It offers primerless adhesion to a wide range of substrates, generates no cure by-products, and exhibits low linear shrinkage. The product features a long working time at room temperature and achieves full cure under elevated temperatures. Its formulation ensures non-corrosiveness to metals and sensitive substrates while maintaining excellent performance across a broad temperature range.


2. Applications

  • Coating of hybrid ICs, printed circuit boards, and electronic devices

  • Dip and spray coating

  • Encapsulation of electronic components

3. Typical Properties

Property Unit Before Mixed After Mixed / Cured (1 hr @ 150°C)
Color Transparent
Viscosity @ 23°C mPa·s 1300
Specific Gravity @ 23°C g/cm³ 0.97
Hardness Shore A 12
Adhesive Strength (Al to Al) MPa 0.1
Dielectric Strength kV/mm 21
Dielectric Constant 2.8
Dissipation Factor 0.001
Volume Resistivity ohm·cm 2 × 10¹⁵
Thermal Expansion Coefficient 1/K 2.5 × 10⁻⁴
Thermal Conductivity W/m·K 0.17

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