Item Name: TSE3250
Manufacturer: Momentive Performance Materials
Technologies: One-component, heat-curable silicone adhesive
Color: Transparent
Cure Type: Heat cure (100°C–150°C depending on cycle)
Package Size: 1 kg cans, 15 kg pails
Shelf Life: Minimum 3 months
TSE3250 is a one-component, heat-curable silicone adhesive with low viscosity, designed primarily for potting and encapsulation. It offers primerless adhesion to a wide range of substrates, generates no cure by-products, and exhibits low linear shrinkage. The product features a long working time at room temperature and achieves full cure under elevated temperatures. Its formulation ensures non-corrosiveness to metals and sensitive substrates while maintaining excellent performance across a broad temperature range.
Coating of hybrid ICs, printed circuit boards, and electronic devices
Dip and spray coating
Encapsulation of electronic components
| Property | Unit | Before Mixed | After Mixed / Cured (1 hr @ 150°C) |
|---|---|---|---|
| Color | – | Transparent | – |
| Viscosity @ 23°C | mPa·s | 1300 | – |
| Specific Gravity @ 23°C | g/cm³ | 0.97 | – |
| Hardness | Shore A | – | 12 |
| Adhesive Strength (Al to Al) | MPa | – | 0.1 |
| Dielectric Strength | kV/mm | – | 21 |
| Dielectric Constant | – | – | 2.8 |
| Dissipation Factor | – | – | 0.001 |
| Volume Resistivity | ohm·cm | – | 2 × 10¹⁵ |
| Thermal Expansion Coefficient | 1/K | – | 2.5 × 10⁻⁴ |
| Thermal Conductivity | W/m·K | – | 0.17 |
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