Applications

TSE3251 – Heat-curable silicone adhesive for potting, encapsulation, coating, and electronic device protection.

  • Item Name: TSE3251

  • Manufacturer: Momentive Performance Materials

  • Technologies: One-component, heat-curable, semi-flowable silicone adhesive/sealant

  • Color: White

  • Cure Type: Heat cure (100 °C – 4 h, 120 °C – 2 h, 150 °C – 1 h)

  • Package Size: 1 kg cans, 18 kg pails

  • Shelf Life: Minimum 3 months (0–10 °C, unopened container)

. Product Overview

TSE3251 is a one-component, heat-curable, semi-flowable silicone adhesive designed for potting and encapsulation. It adheres to a wide range of substrates without the need for a primer and cures at elevated temperatures. The product offers a long working time at room temperature and demonstrates excellent performance across a broad temperature range. It is non-corrosive, produces no cure by-products, and exhibits low linear shrinkage.


2. Applications

  • Coating of hybrid ICs and printed circuit boards

  • Dip coating and encapsulation of electronic devices

  • General adhesive use for many types of substrates

3. Typical Properties

Property Uncured Cured (1 hour at 150°C)
Colour White
Viscosity (mPa·s) 8,500
Specific Gravity (g/cm³) 1.02
Hardness (Shore A) 16
Elongation (%) 200
Tensile Strength (MPa) 0.7
Adhesion (Al to Al, MPa) 0.4
Dielectric Strength (kV/mm) 20
Dielectric Constant 2.8
Dissipation Factor 0.002
Volume Resistivity (ohm·cm) 2×10¹⁵
Thermal Expansion Coefficient (1/K) 2.1×10⁻⁴
Thermal Conductivity (W/m·K) 0.18

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