Item Name: TSE3251
Manufacturer: Momentive Performance Materials
Technologies: One-component, heat-curable, semi-flowable silicone adhesive/sealant
Color: White
Cure Type: Heat cure (100 °C – 4 h, 120 °C – 2 h, 150 °C – 1 h)
Package Size: 1 kg cans, 18 kg pails
Shelf Life: Minimum 3 months (0–10 °C, unopened container)
TSE3251 is a one-component, heat-curable, semi-flowable silicone adhesive designed for potting and encapsulation. It adheres to a wide range of substrates without the need for a primer and cures at elevated temperatures. The product offers a long working time at room temperature and demonstrates excellent performance across a broad temperature range. It is non-corrosive, produces no cure by-products, and exhibits low linear shrinkage.
Coating of hybrid ICs and printed circuit boards
Dip coating and encapsulation of electronic devices
General adhesive use for many types of substrates
| Property | Uncured | Cured (1 hour at 150°C) |
|---|---|---|
| Colour | White | — |
| Viscosity (mPa·s) | 8,500 | — |
| Specific Gravity (g/cm³) | 1.02 | — |
| Hardness (Shore A) | — | 16 |
| Elongation (%) | — | 200 |
| Tensile Strength (MPa) | — | 0.7 |
| Adhesion (Al to Al, MPa) | — | 0.4 |
| Dielectric Strength (kV/mm) | — | 20 |
| Dielectric Constant | — | 2.8 |
| Dissipation Factor | — | 0.002 |
| Volume Resistivity (ohm·cm) | — | 2×10¹⁵ |
| Thermal Expansion Coefficient (1/K) | — | 2.1×10⁻⁴ |
| Thermal Conductivity (W/m·K) | — | 0.18 |
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