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TSE385 – Non-corrosive silicone adhesive/sealant for electronics, telecommunication, and general industrial bonding

  • Item Name: TSE385

  • Manufacturer: Momentive Performance Materials Japan LLC

  • Technologies: One-component, alcohol-cure, non-corrosive silicone adhesive/sealant

  • Color: White

  • Cure Type: Room temperature, moisture cure

  • Package Size: 100 g tubes, 333 ml cartridges

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

TSE385 is a one-component, alcohol-type silicone adhesive that cures at room temperature via moisture in the air. It provides primerless adhesion to a wide range of substrates, including metals, plastics, ceramics, and glass, while remaining non-corrosive to sensitive metals such as copper. The product exhibits excellent high and low temperature resistance (–55°C to 200°C), weatherability, ozone and chemical resistance, and superior electrical insulation. Its low odor and single-component formulation make it simple and convenient to use in industrial and electronic applications.


2. Applications

  • Non-corrosive adhesives for electrical and electronic parts assembly in telecommunications, automotive electronics, home appliances, and audio-TV industries

  • Waterproof sealing for electrical, electronic, and communication equipment

  • General-purpose adhesion for metals, glass, plastics, and other substrates

3. Typical Properties

Property Unit Before Mixed After Mixed / Cured (7 days @ 23°C / 50% RH)
Appearance White paste White elastic rubber
Tack-free Time min 90
Corrosion (MIL-A-46146B) None
Density @ 23°C g/cm³ 1.10
Hardness (Type A) 35
Tensile Strength MPa 2.9
Elongation % 390
Adhesive Strength (Al lap shear) MPa 2.0
Thermal Conductivity W/m·K 0.17
Volume Resistivity Ω·cm 5.0×10¹⁵
Dielectric Strength kV/mm 3.0
Dielectric Constant 3.0
Dissipation Factor 0.0007
Arc Resistance s 101

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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