Item Name: VIGON® SC 210
Manufacturer: ZESTRON
Soil/Flux Compatibility: Solder Pastes, SMT Adhesives, Misprints, Lead-Free Solder Pastes
Chemistry/Key flags: Water-based, surfactant-free, MPC® Technology, biodegradable, halogen-free, residue-free, VOC < 20%, non-foaming
Process/Equipment: Spray-in-air, ultrasonic cleaning, hot/compressed/circulating air drying
Package Size: 1 L, 5 L, 25 L, 200 L
Shelf Life: 5 years
1. Product Overview
VIGON® SC 210 is a water-based stencil cleaning medium, specially formulated with MPC® Technology to effectively remove solder pastes and SMT adhesives. Designed for use in spray-in-air or ultrasonic cleaning systems, it ensures high cleaning performance even at low temperatures starting from 18°C. The cleaner is surfactant-free, non-foaming, low-odor, and residue-free, providing excellent material compatibility with SMT stencils while offering safe and environmentally sustainable use.
2. Applications
Cleaning SMT stencils in spray-in-air and ultrasonic equipment.
Removal of solder pastes and SMT adhesives in a single process.
Misprint cleaning, depending on flux type.
Suitable for both leaded and lead-free solder pastes.
Optimized for industries requiring RoHS, WEEE, and REACH compliance.
3. Typical Properties – Specifications
Density (20°C): 0.95 g/cm³
Surface tension (25°C): 28.5 mN/m
Boiling range: 98 – 229°C / 208 – 444°F
Flash point: None until boiling
pH (10 g/l H₂O): Neutral
Vapor pressure (20°C): ~20 mbar
Solubility in water: Soluble
Cleaning temperature: 18 – 40°C / 64 – 104°F
Application concentration (concentrate): 15 – 20% (diluted with DI water only)
Application concentration (ready-to-use): Pure
Compliance: 100% RoHS 1, 2 & 3, WEEE, REACH; free of SIN & SVHC critical substances
Industry standard: Meets IPC-7526 for stencil and misprint cleaning
Packaging: 1 L, 5 L, 25 L, 200 L containers (concentrate and ready-to-use)
Shelf life: Minimum 5 years in sealed containers stored at 5 – 30°C
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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