WEVOPUR, WEVOPOX, WEVOSIL – Customised potting compounds, adhesives, and sealants for thermal management and durable encapsulation of e-mobility components

WEVOPUR, WEVOPOX, WEVOSIL - Customised potting compounds, adhesives, and sealants for thermal management and durable encapsulation of e-mobility components

How can e-mobility components achieve reliable thermal management, mechanical resilience, and long-term operational safety?

Market Trends: The accelerating adoption of electric vehicles and energy storage systems demands materials that combine high thermal conductivity, chemical resistance, and mechanical stability. Components such as electric motors, battery modules, and on-board chargers require advanced potting compounds, adhesives, sealants, and gap fillers to ensure optimal performance and long service life.

Applications: Wevo’s polyurethane, epoxy, and silicone-based 2K materials are designed for encapsulation and protection of battery cells, PCB-mounted electronics, electric motors, on-board chargers, and power electronics. They can be applied as CIPGs or FIPGs for fully automated assembly lines.

Highlights: These customised materials provide excellent heat dissipation, low viscosity for void-free potting, high elongation and flexibility, and compliance with UL 94 flammability standards. They withstand chemical and thermal stress while preventing mechanical fatigue and partial discharges in high-density electronic components.

Product Advantage: By combining precise property tuning, chemical resilience, and rapid processing, Wevo’s materials ensure enhanced operational reliability, longer maintenance intervals, and improved performance of modern e-mobility systems.

RELATED POST

Insights

LOCTITE ECCOBOND UF 9000AG-061 – Epoxy Underfill Encapsulant – Semiconductor Flip Chip Packaging for mobile, automotive, and high-performance computing applications

LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.

Insights

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

Insights

BERGQUIST® GAP FILLER TGF 2900LVO – Thermal Gap Filler – Automotive, Industrial and Consumer Electronics Assembly Applications

BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.

Contact Technical Support

Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.

(+84) 889 901 929

Email: info@techniq.vn

Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).

For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.