How can modern electronics achieve optimal thermal management, mechanical stress damping, and reliability in compact designs?
✨ Market Trends: With the accelerating adoption of E-Mobility, advanced ECUs, and high-frequency power electronics, the demand for thermally conductive, supersoft potting compounds has surged. Engineers increasingly require materials that combine low density, high mechanical damping, and superior heat dissipation.
✨ Applications: WEVOSIL 22106 FL, 22102 FL, and 22105 FL serve a wide spectrum of electronic components including wire bonds, inductive devices such as chokes and transformers (with or without ferrite cores), EMI/Pi filters, PFC circuits, and ECUs in trains and electric vehicles, where precision potting is critical.
✨ Highlights: Featuring Shore 00 hardness of ~60, these electro casting silicones deliver exceptional vibration and shock damping. The series offers tailored thermal conductivities from 0.5 to 1.5 W/m-K and elongation at break above 100%, ensuring both efficient heat transfer and long-term thermal stability (180–200 °C). Their low-viscosity, high-flow formulations (<5,000 mPa·s) enable bubble-free encapsulation in complex geometries.
✨ Product Advantage: By combining thermally conductive fillers, high adhesion, and ultra-soft consistency, WEVOSIL 2210x compounds provide unparalleled mechanical and thermal reliability, optimize potting processes, and support technological advancement in high-performance electronic assemblies.
