How can modern electronics achieve efficient thermal management with minimal bondline thickness and high production reliability?
✨ Market Trends: As power electronics and battery technologies evolve, thermal interface materials (TIMs) are increasingly required to combine high thermal conductivity, low thermal resistance, and mechanical resilience. Manufacturers demand solutions that maintain performance under high temperatures, rapid production cycles, and large unit volumes.
✨ Applications: WEVOSIL 26040 FL is ideal for thermally critical joints in power electronics, automotive battery systems, PV modules, and high-density circuit assemblies, ensuring precise heat dissipation and long-term operational stability.
✨ Highlights: With a thermal conductivity of 4 W/m*K (ASTM D5470-2017) and ultra-low bondline thickness below 70 µm, this silicone gap filler guarantees efficient heat transfer. Its optimised filler combination, high sedimentation stability, elongation at break >30%, UL 94 V-0 flame-retardancy, and low volatile emissions (PV 3040 compliant) make it highly process-friendly and suitable for large-scale automated dispensing.
✨ Product Advantage: By integrating high thermal performance, mechanical reliability, and precise dosing properties, WEVOSIL 26040 FL supports enhanced production efficiency and prolonged service life of advanced electronic assemblies.
