Item Name: Araldite® MY 740 / Aradur™ HY 840-1
Manufacturer: Huntsman Advanced Materials (formerly Vantico Ltd)
Technologies: Two-component bisphenol A epoxy resin with polyamino hardener for casting and encapsulation
Color: Resin – Clear liquid; Hardener – Clear to pale liquid
Cure Type: Cold to warm curing (room temperature to 80 °C)
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
Araldite® MY 740 (resin) with Aradur™ HY 840-1 (hardener) is a liquid, low-viscosity, cold- to warm-curing epoxy impregnating and casting resin system.
Moderate reactivity, high flexibility after cure.
Suitable for Class A insulation applications (105 °C).
Good mechanical and electrical performance with low exotherm during cure.
Mix ratio: 100 pbw resin : 50–100 pbw hardener, depending on performance requirements.
Encapsulation and casting of electronic devices, especially printed wiring boards (PWBs).
Designed for casting with or without vacuum.
Useful where mechanical toughness and electrical insulation are essential.
| Property | Araldite® MY 740 (Resin) | Aradur™ HY 840-1 (Hardener) |
|---|---|---|
| Form | Clear liquid | Liquid |
| Chemistry | Bisphenol A epoxy resin | Modified polyamino curing agent |
| Viscosity (25 °C) | 10,000 – 14,500 mPa·s | 10,000 – 15,000 mPa·s |
| Viscosity (75 °C) | – | 300 – 600 mPa·s |
| Density (25 °C) | 1.15 – 1.20 g/cm³ | 0.96 – 1.0 g/cm³ |
| Epoxy content | 5.25 – 5.55 eq/kg | – |
| Vapour pressure | <0.00001 mbar | <0.01 mbar |
| Flash point | 200 °C | >140 °C |
| Property | Value |
|---|---|
| Recommended Mix Ratio | 100 : 50–70 pbw (optimum electrical) |
| Alternative Mix Ratio | Up to 100 : 100 pbw (best sealing/adhesion) |
| Initial Viscosity (25 °C / 40 °C) | 14,000 mPa·s / 2,400 mPa·s |
| Pot Life (to 50,000 mPa·s) | 80 min (25 °C), 65 min (40 °C) |
| Gel Time | 85 min (40 °C), 27 min (60 °C) |
| Recommended Cure | 8 h / 80 °C |
| Alternative Cure | 24 h / 23 °C + 8 h / 80 °C |
| Property | Value |
|---|---|
| Flexural Strength | 105 – 110 MPa |
| Surface Strain | 8.5 – 9.0 % |
| Elastic Modulus | 2,470 – 2,540 MPa |
| Shore D Hardness | 80 – 85 |
| Glass Transition Temp (Tg, DSC) | ~90 °C |
| Decomposition Temp | >300 °C |
| Property | Value |
|---|---|
| Breakdown Strength (3 mm) | 20 – 24 kV/mm |
| Dielectric Loss Factor (tan δ, 50 Hz) | 0.4 % (23 °C); 10.3 % (80 °C) |
| Dielectric Constant (εr, 50 Hz) | 2.2 (25 °C), 3.3 (80 °C) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.