Applications

Araldite® MY 740 / Aradur™ HY 840-1 epoxy casting system for encapsulating electronics, offering high flexibility, insulation, and Class A suitability.

  • Item Name: Araldite® MY 740 / Aradur™ HY 840-1

  • Manufacturer: Huntsman Advanced Materials (formerly Vantico Ltd)

  • Technologies: Two-component bisphenol A epoxy resin with polyamino hardener for casting and encapsulation

  • Color: Resin – Clear liquid; Hardener – Clear to pale liquid

  • Cure Type: Cold to warm curing (room temperature to 80 °C)

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

Araldite® MY 740 (resin) with Aradur™ HY 840-1 (hardener) is a liquid, low-viscosity, cold- to warm-curing epoxy impregnating and casting resin system.

  • Moderate reactivity, high flexibility after cure.

  • Suitable for Class A insulation applications (105 °C).

  • Good mechanical and electrical performance with low exotherm during cure.

  • Mix ratio: 100 pbw resin : 50–100 pbw hardener, depending on performance requirements.


2. Applications

  • Encapsulation and casting of electronic devices, especially printed wiring boards (PWBs).

  • Designed for casting with or without vacuum.

  • Useful where mechanical toughness and electrical insulation are essential.

3. Typical Properties

A. Components (Unmixed)

Property Araldite® MY 740 (Resin) Aradur™ HY 840-1 (Hardener)
Form Clear liquid Liquid
Chemistry Bisphenol A epoxy resin Modified polyamino curing agent
Viscosity (25 °C) 10,000 – 14,500 mPa·s 10,000 – 15,000 mPa·s
Viscosity (75 °C) 300 – 600 mPa·s
Density (25 °C) 1.15 – 1.20 g/cm³ 0.96 – 1.0 g/cm³
Epoxy content 5.25 – 5.55 eq/kg
Vapour pressure <0.00001 mbar <0.01 mbar
Flash point 200 °C >140 °C

B. Mixed System & Processing

Property Value
Recommended Mix Ratio 100 : 50–70 pbw (optimum electrical)
Alternative Mix Ratio Up to 100 : 100 pbw (best sealing/adhesion)
Initial Viscosity (25 °C / 40 °C) 14,000 mPa·s / 2,400 mPa·s
Pot Life (to 50,000 mPa·s) 80 min (25 °C), 65 min (40 °C)
Gel Time 85 min (40 °C), 27 min (60 °C)
Recommended Cure 8 h / 80 °C
Alternative Cure 24 h / 23 °C + 8 h / 80 °C

C. Mechanical & Physical Properties (Cured 8 h / 80 °C)

Property Value
Flexural Strength 105 – 110 MPa
Surface Strain 8.5 – 9.0 %
Elastic Modulus 2,470 – 2,540 MPa
Shore D Hardness 80 – 85
Glass Transition Temp (Tg, DSC) ~90 °C
Decomposition Temp >300 °C

D. Electrical Properties (Cured 8 h / 80 °C)

Property Value
Breakdown Strength (3 mm) 20 – 24 kV/mm
Dielectric Loss Factor (tan δ, 50 Hz) 0.4 % (23 °C); 10.3 % (80 °C)
Dielectric Constant (εr, 50 Hz) 2.2 (25 °C), 3.3 (80 °C)

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