Item Name: DOWSIL™ CC-8033 UV and Moisture Dual Cure Conformal Coating Adhesive
Manufacturer: The Dow Chemical Company
Technologies: One-part, UV and moisture dual-cure silicone conformal coating
Color: Translucent
Cure Type: UV/LED cure with secondary moisture cure
Package Size: Contact Dow representative for available packaging
Shelf Life: Contact Dow representative for storage and shelf life details
DOWSIL™ CC-8033 is a one-part, translucent conformal coating and adhesive with dual cure capability: fast UV or LED curing combined with a secondary moisture cure. It is solvent-free, stress-relieving, and offers a tack-free surface with reduced oxygen inhibition. The material provides strong adhesion to most circuit board substrates, incorporates a UV indicator for inspection, and is designed to balance high reliability with easy processing. It maintains stable performance across demanding electronic environments while offering high transparency and environmental resistance.
The adhesive is intended for e-motors, automotive boards and assemblies, power supplies, modules, power tools, control units, connectors (pin/solder joint coverage), home appliances, and rigid circuit boards. It is especially suited for electronics requiring rapid UV curing, moisture protection, and long-term operational reliability.
DOWSIL™ CC-8033 combines flowable yet thixotropic behavior, enabling both spray and needle dispense application. Its dual cure system ensures fast UV/LED curing with secondary moisture curing to achieve complete crosslinking in shadowed or hidden areas. The cured material has medium softness, moderate tensile strength, and over 100% elongation, providing flexibility and stress relief. Electrically, it offers excellent dielectric strength, low dissipation factor, and high resistivity, making it ideal for conformal coating of sensitive circuitry. With a wide service temperature range (-40 to 150°C), UL 94 V-0 flame resistance, and the ability to cure up to several millimeters deep under high UV dosage, the coating ensures durable protection for modern electronic assemblies.
| Property | Unit | Result | Condition/Note |
|---|---|---|---|
| One/Two Part | – | One | – |
| Color | – | Translucent | Uncured |
| Non-volatile Content | % | 95 | Uncured |
| Viscosity | cP | 15,000 | Uncured |
| Specific Gravity | – | 1.0 | Cured |
| Durometer | Shore A | 30 | Cured |
| Tensile Strength | psi | 150 | Cured |
| Elongation | % | 105 | Cured |
| Dielectric Strength | V/mil | 415 | Non-dried |
| Volume Resistivity | ohm·cm | 1.1E13 | Non-dried |
| Dielectric Constant | – | 2.66 (100 Hz) / 2.66 (100 kHz) | Cured |
| Dissipation Factor | – | 0.0054 (100 Hz) / <0.002 (100 kHz) | Cured |
| UV Cure Depth | mm | up to 6.2 | High dosage (LED/UV) |
| Temperature Range | °C | -40 to 150 | Long-term use |
| Certification | – | UL 94 V-0 | Flame resistance |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.