1. Product Overview
DOWSIL™ EA-4100 is a one-part, white, moisture-cure silicone adhesive formulated for needle dispensing. It cures at room temperature under ambient humidity, eliminating the need for curing ovens and reducing energy costs. The adhesive achieves most of its final physical properties within 24–72 hours, though handling can typically occur within minutes to a few hours. It provides consistent mechanical and electrical performance across a broad temperature range, with excellent adhesion to reactive metals, ceramics, glass, and certain plastics.
2. Applications
The adhesive is suited for PCB system assemblies, electronics bonding, and general component attachment where reliable adhesion, moderate flexibility, and stable performance under thermal cycling are required. It can be applied in automated or manual dispense processes and is effective in situations needing fast throughput and broad environmental durability.
3. Typical Properties
DOWSIL™ EA-4100 adhesive is designed to balance mechanical strength, flexibility, and processability. In its uncured state, it is a white paste with good extrusion rate and controlled slump, making it easy to dispense and apply precisely. Upon curing, it achieves medium hardness, good tensile strength, and reliable elongation, ensuring durability under vibration and thermal stress. With a tack-free time of about 9 minutes, it supports rapid assembly lines. The material performs well across -45°C to 200°C, tolerates intermittent solvent exposure, and maintains stable properties in electronics applications, extending device service life.
| Property |
Unit |
Result |
Condition/Note |
| One/Two Part |
– |
One |
– |
| Color |
– |
White paste |
Uncured |
| Durometer |
Shore A |
45 |
Cured |
| Elongation |
% |
250 |
Cured |
| Extrusion Rate |
g/min |
260 |
Uncured |
| Slump |
cm |
0.4 |
Uncured |
| Specific Gravity |
– |
1.42 |
Cured |
| Tack-Free Time |
min |
9 |
25°C |
| Tensile Strength |
psi / MPa / kg/cm² |
335 / 2.3 / 23 |
Cured |