Item Name: DOWSIL™ EA-5151 QiC Assembly Adhesive Clear
Manufacturer: The Dow Chemical Company
Technologies: One-component, neutral moisture-cure, heat-assisted silicone pressure-sensitive adhesive
Color: Clear
Cure Type: Moisture-cure with heat-assisted dispensing
Package Size: 304 mL cartridge, 22 kg pail, 205 kg drum
Shelf Life: 12 months
DOWSIL™ EA-5151 QiC Assembly Adhesive Clear is a one-component, neutral-cure silicone adhesive designed for quick-in-connect (QiC) applications. It delivers instant green strength for immediate handling, combines high transparency with UV stability, and offers primerless adhesion to many substrates. The product maintains long-term performance across a broad temperature range and is easy to dispense with standard heat-assisted equipment. Its low VOC and non-hazardous composition make it suitable for demanding industrial and electronic uses.
The adhesive is used in automotive electronics, industrial and energy control units, sensors, displays, battery packs, connectors, lid sealing, gasketing, and general component attachment. It is particularly valuable in applications requiring fast handling strength, strong adhesion, and thermal durability.
DOWSIL™ EA-5151 QiC adhesive is engineered for robust mechanical, thermal, and electrical performance. In uncured form, it presents as a clear material with controlled viscosity, enabling precise dispensing. After curing, it provides strong adhesion to metals, plastics, and composites, with high tensile strength and elasticity. It maintains flexibility across -50°C to 150°C, exhibits outstanding dielectric strength, low dissipation factor, and excellent transparency in the visible range. This balance of mechanical resilience and electrical insulation makes it ideal for sensitive electronic assemblies while ensuring long service reliability in harsh environments.
| Property | Unit | Result | Condition/Note |
|---|---|---|---|
| Appearance | – | Clear | Uncured |
| Specific Gravity | – | 1.08 | Uncured |
| Viscosity | Pa·s | 200 @100°C / 70 @120°C | Uncured |
| Non-Volatile Content | % | >98.5 | Uncured |
| Open Time | min | 15 | Uncured |
| Lap Shear – Al | MPa | 0.1 / 0.2 / 1.15 | 15 min / 1 day / 21 days |
| Lap Shear – FR4/PC/PMMA/PTFE | MPa | 1 / 0.9 / 0.8 / 0.7 | 21 days |
| Durometer (Shore A) | points | 60 | Cured |
| Tensile Strength | MPa | 4.3 | Cured |
| Elongation | % | 1300 | Cured |
| Linear CTE | ppm/°C | 230 | Cured |
| Dielectric Strength | kV/mm | 24 | Cured |
| Volume Resistivity | ohm·cm | 1E+16 | Cured |
| Dielectric Constant | – | 2.82 (100 Hz) / 2.60 (100 kHz) | Cured |
| Dissipation Factor | – | 0.0095 (100 Hz) / 0.0012 (100 kHz) | Cured |
| Light Transmittance | % | 94 @380/450/760 nm | 1 mm film |
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