Item Numbers: KAPPA 700H (C-frame, shuttle station, side injection, built-in 7L melt tank)
Manufacturer: LPMS USA
Application: Low pressure molding for PCB and electronics encapsulation, waterproofing, strain relief, vibration protection
Dispensing Control: 7L melt tank, two thermal zones, seven-inch PLC touchscreen, ejection system, shuttle station
Size & Weight: 1340 × 1210 × 1810 mm, 470 kg (1036 lbs), max mold size 290 × 270 × 150 mm
Power & Certification: 200–240 VAC, 1 Phase, 50/60 Hz, 25A, air pressure 0.20–0.60 MPa, safety features: E-stop, light curtain
More information & technologies: Contact to Techniq VN for details. (Email: info@techniq.vn & Tel: +84 88 990 19 29)
1. Product Overview
The KAPPA 700H is a state-of-the-art low pressure molding machine engineered to provide superior protection for sensitive electronics. It incorporates a side injection shuttle table with a 7-litre built-in melt tank, dual thermal control zones for precise process stability, and advanced safety features including a light curtain and dual-palm controls. With its compact C-frame design, high reliability, and user-friendly seven-inch touchscreen PLC, the KAPPA 700H ensures consistent encapsulation, reduced cycle times, and efficient production for critical electronic assemblies.
2. Applications
The KAPPA 700H is primarily used for circuit board and electronic component encapsulation, offering exceptional waterproofing, strain relief, vibration resistance, and chemical protection. It is particularly suitable for overmolding connectors, sensors, switches, wires, cables, and batteries. By replacing traditional potting and conformal coating, the system streamlines manufacturing, reduces costs, and enhances design flexibility across industries such as automotive, consumer electronics, medical devices, and industrial equipment.
3. Typical Properties – Specifications
| Parameter | Specification |
|---|---|
| Machine Size | 1340 × 1210 × 1810 mm · 470 kg (52.76 × 47.64 × 71.26 in · 1036 lbs) |
| Electricity | 200–240 VAC · 1 Phase · 50/60 Hz · 25A |
| Air Pressure | 0.20–0.60 MPa · 30–100 psi |
| Air Requirement | > 90 psi |
| Clamping Method | Air cylinder |
| Clamping Force | 5 Ton |
| Clamping Stroke | 75 mm (2.85 in) |
| Maximum Mold Size | 290 × 270 × 150 mm (11.41 × 10.63 × 5.91 in) |
| Nozzle | LPMS-G10 |
| Melt Tank Volume | 7 L |
| Temperature Control Zones | 2 |
| Safety Features | E-stop and light curtain |
| Additional Feature | Shuttle station with ejection system for easy part removal |
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Email: info@techniq.vn
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