1. Product Overview
The LPMS 900H Series is a precision-engineered low pressure molding machine, designed to encapsulate sensitive electronics with hot melt adhesives. It combines horizontal or vertical rotary injection with a single-station system and external melt tank, offering superior waterproofing, strain relief, and design flexibility compared with potting or high-pressure injection molding.
2. Applications
Ideal for encapsulating PCBs, sensors, switches, connectors, and batteries, the system delivers environmental sealing, vibration and impact resistance, strain relief for cables, and customizable overmolding options. It serves electronics, automotive, consumer devices, and industrial equipment industries, ensuring high reliability in demanding environments.
3. Typical Properties – Specifications
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Machine Dimensions: 1400 × 1000 × 2100 mm, 1553 lbs
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Electricity: 220 VAC, 1 Phase, 50/60 Hz, 50A
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Air Input: 90–110 PSI, 7 CFM
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Clamping Method: Air-over-oil cylinder
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Clamping Force: 5 tons standard, 10 tons optional
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Clamping Stroke: 150 mm
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Max. Mold Size: 300 × 160 × 150 mm
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Safety Features: Light curtains, emergency stop, interlocks, lockout/tagout
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Melt Tank: 7L square standard, 5L round optional
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Temperature Control Zones: 3
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Processing Parameters: 20–500 psi injection pressure, viscosity 1,000–10,000 cps
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Performance Range: -65°C to +200°C
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Materials: Polyamide, polyolefin, co-polyester, UL 94 V-0, RoHS & REACH compliant