Item Number: CVP-390 SAC30
Manufacturer: MacDermid Alpha®
Lead Type: Lead-Free (RoHS compliant)
Alloys: SAC305 (Sn96.5/Ag3.0/Cu0.5)
Type: No-clean, zero-halogen solder paste
Package: 500 g jar; 600 g cartridge
Shelf Life: 6 months (refrigerated at 0–10 °C)
MacDermid Alpha CVP-390 SAC30 Solder Paste is a high-reliability, lead-free solder paste designed for advanced electronics assembly. It offers excellent wetting, superior solder joint formation, and consistent performance in fine-pitch and high-density surface mount assemblies. The paste is formulated to leave minimal, non-corrosive residues, making it suitable for no-clean processes and high-reliability applications.
CVP-390 SAC30 is ideal for surface mount technology (SMT) applications, including BGAs, QFNs, and other fine-pitch components. It supports stencil printing, syringe dispensing, and rework operations, ensuring precise and repeatable solder deposition. The paste is particularly suitable for high-volume production environments where consistency and joint reliability are critical.
Alloy Composition: SAC305 (Sn96.5/Ag3.0/Cu0.5) or SAC30 variant
Flux Type: No-clean, halogen-free
Viscosity: Optimized for stencil printing and dispensing
Residues: Minimal, non-corrosive, safe for no-clean processes
Print Life: Extended stencil life under standard production conditions
Reflow Profile: Compatible with lead-free reflow temperature profiles
Storage: Refrigerated storage recommended to maintain paste consistency and performance
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.