Item Number: MX-5200 Series (includes MX-5210, MX-5211, MX-5220, MX-5241, MX-5250, MX-5251)
Manufacturer: Metcal (OK International, Cypress, California, USA)
Application: Soldering, desoldering, and rework of SMD, through-hole, high-mass, and thermally sensitive components
Key Technology: SmartHeat® with dynamic power sharing, Connection Validation™, specialized hand-pieces and tip geometries
Heating Method: Induction heating at 13.56 MHz for precise, rapid temperature response
Compatibility: Backward compatible with Metcal MX-500 systems; supports STTC, SMTC, PTTC, STDC, UFTC cartridges
Specifications: 100–240 VAC, 125 W, 80 W/channel, CE/cTUVus certified, compact 12.1×13.0×23.5 cm, ESD safe
The MX-5200 Series Dual Simultaneous Soldering Systems represent Metcal’s advanced solution for soldering, desoldering, and rework applications. Building on the MX-5000 platform, this series introduces dual-port functionality, enabling two hand-pieces to operate simultaneously with dynamic power-sharing of up to 80 watts per channel. The system integrates SmartHeat® technology for precise power-on-demand delivery, ensuring reliability, process control, and enhanced operator efficiency.
The MX-5200 series offers a broad scope of use across modern electronics assembly and repair:
General soldering and rework – Suitable for high-volume production, lead-free applications, and touch-up tasks.
UltraFine™ soldering – Specialized hand-piece for delicate components, restricted spaces, and high-density PCBs.
Precision tweezer rework – Designed for surface-mount component removal and replacement.
Through-hole desoldering – Using the MX-DS1 hand-piece for plated-through-hole component extraction.
High thermal demand soldering – With the MX-H6-HTD hand-piece, ensuring stable operation on large thermal mass components.
Power Output: 80 W max. per channel (dynamic dual sharing)
Input Voltage: 100–240 VAC, 50/60 Hz
Operating Temperature: 10 – 40 °C
Max Enclosure Temp: 55 °C
Output Frequency: 13.56 MHz
Temperature Stability: ±1.1 °C (still air)
Tip-to-Ground Potential: < 2 mV
Tip-to-Ground Resistance: < 2 Ω
Dimensions (PSU): 12.1 × 13.0 × 23.5 cm; Weight: 3.35 kg
Workstand Dimensions: 8.6 × 19.1 × 8.3 cm; Weight: 0.476 kg
Certification: cTUVus, CE
Hand-piece Cable Length: 122 cm, ESD-safe, burn-proof
Connector Type: F connector
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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